SIMCOM无线通讯模块
产品简介
详细信息
特征
| General features • Quad-Band FDD-LTE B2/B4/B5/B17 • Dual-Band WCDMA/HSDPA/HSPA+ B2/B5 • Control Via AT Commands or Gobi API • Supply voltage range: 3.4V~4.2V • Operation temperature: -40℃~ +85℃ • Dimension: 30*30*2.9mm • Weight: 5.8g • LTE-FDD/Rel-9 Cat3 • HSPA+ DC-HSPA+, Rel-10 HSPA+ • GNSS: gpsOne Gen 8B; standalone; assisted, XTRA Specifications for Data transfer • LTE -Uplink up to: 50Mbps -Downlink up to: 100Mbps • HSPA+ -Uplink up to: 5.76Mbps -Downlink up to: 42Mbps • WCDMA -Uplink/Downlink up to: 384Kbps • CSD -WCDMA data rate: 57.6Kbps -WCDMA 64Kbps CSD for Video call | Other features • USB Driver for Microsoft Windows 2000/XP/Vista/Win7/Win8 • USB Driver for Windows CE/ • USB Driver for Linux/Android • RIL support for Android/Windows CE/ • Automatic installation for Windows • Linux API SDK • Firmware update via USB • TCP/IP/*4/V6 Multi-PDP, MT PDP • FTP/FTPS/HTTP/HTTPS/SMTP/POP3/DNS/MMS • DTMF • Gobi SDK to the Win7/Win8/Linux • MBIM to Win8 • Source code of the PC manager of the device for reference Interfaces • USB2.0 • UART • SIM card • SPI • I2C • Constant current sink • GPIO • ADC • PCM • SDIO Certifications • FCC • PTCRB • IC • AT&T • ROHS • REACH |